IS 10922 : 1984 /IEC Pub 249-3A : 1976 Specification for Copper Foil for Use in the Manufacture of Copper-clad Base Material
| UDC 621.3.049.75 : 669.3-416 : 669.384.002.3 | LITD 24 |
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| Reaffirmed 2016 |
National Foreword
This Indian Standard, which is identical with Specification No.2 of IEC pub 249-3A (1976) Metal-clad base materials for printedcircuits, Part 3 : Special materials used in connection withprinted circuits, Specification No. 2 : Specification for copperfoil for use in the manufacture of copper-clad base materials,issued by the International Electrotechnical Commission (IEC), wasadopted by the Indian Standards Institution on the recommendationof the Printed Circuits Sectional Committee and approved by theElectronics and Telecommunication Division Council.
| International Standard | Corresponding Indian Standard |
| IEC Pub 249-1 | IS 5921 : Part 1 : 1983 Specification for metal-clad base materials for printed circuits for use in electronics and telecommunication equipment : Part 1 General requirements and tests (Technically equivalent) |
| IEC Pub 249-2 | IS 5921 Specification for metal-clad base materials for printed circuits for use in electronics and telecommunication equipment (Relevant parts) (Technically equivalent) |
| IEC Pub 68-2-20C | IS 9000 : Part XVIII : Sec 3 : 1981 Basic environmental testing procedures for electronic and electrical items : Part XVIII Solderability test, Section 3 Solderability of printed boards and metal clad laminates (Technically equivalent) |