IS 12284 : 1988 Specificatiion for prepreg for use in multilayer printed boards

1 Scope

1.1 This standard specifies the requirements for two types ofepoxide resin impregnated woven glass fabric with the resin curedto a B-stage. They are used for bonding together printed circuitsformed from metal-clad epoxide glass laminates to producemultilayer printed boards.

2 Reference

IS 1885 : Part 6 :1978 Electrotechnical vocabulary: Part 6 Printed circuits