IS 2603 : 1983 Copper anodes for electroplating
| UDC 621.3.035.221.289 [669.3] : 621.357.7 | MTD 24 |
|
| Reaffirmed 2021 |
1 Scope
1.1 This standard covers the requirements for copper anodes usedin electroplating.
2 References
IS 2 :1960Rules for rounding off numerical values
IS 191 : Part 5 : 1980 Specification for copper:Part 5 Electrolytic tough pitch copper (ETP)
IS 440 :1964Methods of chemical analysis of copper