IS 998 : Part 3 : 1983 Methods of chemical analysis of solders (soft and rosin cored) Part 3 Determination of cadmium, zinc, aluminium, bismuth and nickel
UDC 621.791.35 : 543 | MTD 34 |
|
Reaffirmed 2014 |
1 Scope
1.1 This standard (Part 3) covers photometric methods of determination ofcadmium, zinc, aluminium, bismuth and nickel in lead and tin base solders (seeIS : 193-1982 and IS : 1921-1975) having chemical composition within thefollowing range:
Constituents Percent
Cadmium 0.005 Max
Zinc 0.003 Max
Aluminium 0.001 Max
Bismuth 0.05 Max
Nickel 0.002 Max
2 References
IS 2 :1960 Rules for rounding off numericalvalues
IS 193 :1982 Specification for soft solder
IS 1070 :1977 Specification for water for general laboratory use
IS 1921 :1975 Specification for rosin cored solder wire