IS 998 : Part 3 : 1983 Methods of chemical analysis of solders (soft and rosin cored) Part 3 Determination of cadmium, zinc, aluminium, bismuth and nickel

UDC 621.791.35 : 543 MTD 34
Reaffirmed 2014

1 Scope

1.1 This standard (Part 3) covers photometric methods of determination ofcadmium, zinc, aluminium, bismuth and nickel in lead and tin base solders (seeIS : 193-1982 and IS : 1921-1975) having chemical composition within thefollowing range:

Constituents   Percent

Cadmium        0.005 Max

Zinc           0.003 Max

Aluminium      0.001 Max

Bismuth        0.05 Max

Nickel         0.002 Max

2 References

IS 2 :1960 Rules for rounding off numericalvalues

IS 193 :1982 Specification for soft solder

IS 1070 :1977 Specification for water for general laboratory use

IS 1921 :1975 Specification for rosin cored solder wire