IS/IEC 60068 : Part 2 : Sec 58 : 2015 Environmental Testing Part 2 Tests Section 58 Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices ( SMD )

ICS 19.040; 31.190

LITD 05

New Standard from Last Update.

NATIONAL FOREWORD

This Indian (Part 2/Sec 58) which is identical with IEC 60068-2-58 : 2015 ‘Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)’ issued by the International Electrotechnical Commission (IEC) was adopted by the Bureau of Indian Standards on recommendation of the Semiconductor Devices Components and Electronic Assembly Technology Sectional Committee and approval of the Electronics and Information Technology Division Council.

The text of IEC Standard has been approved as suitable for publication as an Indian Standard without deviations. Certain terminologies and conventions are, however, not identical to those used in Indian Standards. Attention is particularly drawn to the following:

a) Wherever the words ‘International Standard’ appear referring to this standard, they should be read as ‘Indian Standard’.

b) Comma (,) has been used as a decimal marker, while in Indian Standards, the current practice is to use a point (.) as the decimal marker.