IS/IEC 60068 : Part 2 : Sec 83 : 2011 Environmental Testing Part 2 Tests Section 83 Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

ICS 19.040; 31.190

LITD 05

New Standard from Last Update.

NATIONAL FOREWORD

This Indian (Part 2/Sec 83) which is identical with IEC 60068-2-83 : 2011 ‘Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste’ issued by the International Electrotechnical Commission (IEC) was adopted by the Bureau of Indian Standards on recommendation of the Semiconductor Devices Components and Electronic Assembly Technology Sectional Committee and approval of the Electronics and Information Technology Division Council.

The text of IEC Standard has been approved as suitable for publication as an Indian Standard without deviations. Certain terminologies and conventions are, however, not identical to those used in Indian Standards. Attention is particularly drawn to the following:

a) Wherever the words ‘International Standard’ appear referring to this standard, they should be read as ‘Indian Standard’.

b) Comma (,) has been used as a decimal marker, while in Indian Standards, the current practice is to use a point (.) as the decimal marker.