IS/IEC 61189 : Part 3 : 2007 Test Methods for Electrical Materials, Printed Boards and Other Interconnection Structures and Assemblies Part 3 Test Methods for Interconnection Structures ( Printed Boards )
New Standard from Last Update.
NATIONAL FOREWORD
This Indian Standard (Part 3) which is identical with IEC 61189-3 : 2007 ‘Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)’ issued by the International Electrotechnical Commission (IEC) was adopted by the Bureau of Indian Standards on recommendation of the Semiconductor Devices Components and Electronic Assembly Technology Sectional Committee and approval of the Electronics and Information Technology Division Council.