IS/IEC 61189 : Part 5 : 2006 Test Methods for Electrical Materials, Interconnection Structures and Assemblies Part 5 Test Methods for Printed Board Assemblies

ICS 31.180

LITD 05

New Standard from Last Update.

NATIONAL FOREWORD

This Indian Standard (Part 5) which is identical with IEC 61189-5 : 2006 ‘Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies’ issued by the International Electrotechnical Commission (IEC) was adopted by the Bureau of Indian Standards on recommendation of the Semiconductor Devices Components and Electronic Assembly Technology Sectional Committee and approval of the Electronics and Information Technology Division Council.