New Standard from Last Update.

NATIONAL FOREWORD

This Indian ((Part 4) which is identical with IEC 62137-4 : 2014 ‘Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices’ issued by the International Electrotechnical Commission (IEC) was adopted by the Bureau of Indian Standards on recommendation of the Semiconductor Devices Components and Electronic Assembly Technology Sectional Committee and approval of the Electronics and Information Technology Division Council.