IS/IEC 60691 : 2023 Thermal-Links - Requirements and Application Guide
NATIONAL FOREWORD
This Indian Standard (Second Revision) which is identical to IEC 60691 : 2023 'Thermal-links - Requirements and application guide' issued by the International Electrotechnical Commission (IEC), was adopted by the Bureau of Indian Standards on the recommendation of the Fuses Sectional Committee and approval of the Electrotechnical Division Council.
This standard was first published in 1993 and subsequently revised in 2018 based on IEC 60691 : 2015. This revision has been undertaken to align it with the latest version of IEC standard.
This revision includes the following significant technical changes with respect to the previous version:
a) Requirements for thermal-link packaged assemblies; and
b) Renew the requirements and definitions for Th-test;
The text of the IEC standard has been approved as suitable for publication as an Indian Standard without deviations. Certain conventions are, however, not identical to those used in Indian Standards. Attention is particularly drawn to the following:
a) Wherever the words 'International Standard' appears referring to this standard, they should be read as 'Indian Standard'; and
b) Comma (,) has been used as a decimal marker, while in Indian Standards the current practice is to use a point (.) as the decimal marker.