You Searched for - is/iec 62137 : part 4
  • 1
    IS/IEC 62137 : Part 4 : 2014 ( IEC 62137-4: 2014)    

    Electronics assembly technology Part 4 Endurance test methods for solder joint of area array type package surface mount devices

    Technical Committee : LITD 5
    Status : Active

    No. of Amendments : 0
    Price : ₹ 5,800.00 ( US$ 68.00)

BSB Edge is Official Distributers of various international standards.
We represent ASME, AFNOR, API, ASNT, ASTM, BIS, ACI, BSI, CSA, DIN, HI, ISO, AWWA, IEC, IEEE, JSA, NBBI, SAE, UL, NACE, HSB, AIAG.
You can download international standards from our website : www.bsbedge.com

** This site best viewed in Google Chrome.